Shenzhen Xuancai Electronic Co., Ltd
Shenzhen Xuancai Electronic Co.,Ltd, founded in 2007,is a professional manufacturer of high power cob chips.With a wide range, good quality and reasonable price,our products are extensively used in
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UV 365 LED Chip Korea LG Chip Good Quality 45*45 3 Years' Warranty 1600-2000mW CE ROHS For 3D Printing/ Ink Curing
Applications
ultraviolet disinfection/ uv curing/ UV Ink Curing/ Printing/ Moth-killing lamp/ l Medical treatment and health/ General use
Product Parameters
Features
1. Size(mm): 3.45×3.45×1.95
2. Ceramic and silicone molding package
3. Suitable for all SMT assembly and solder process
4. Wide viewing angle: 120°
5. Pb-free reflow soldering application
6. RoHS compliant
Package Dimensions
Typical Optical/ Electrical Characteristics @Ta=25℃
| Symbol | Item | Min. | Typ. | Max. | Units | Test Conditions
|
| Ie | Radiant intensity | — | — | — | mW/sr | IF=700mA |
| Φe | Radiation Power | 1200 | 1500 | — | mw | IF=700mA |
| VF | Forward Voltage | 3.2 | 3.8 | — | v | IF=700mA |
| λd | Wave length | — | — | — | nm | IF=700mA |
| λp | PeakWavelength | 365 | — | 370 | nm | IF=700mA |
| 20-1/2 | 50% power angle | — | 120 | deg | IF=700mA | |
| IR | Reverse Current | — | — | 20 | uA | VR = 5V |
Electro-Optical Characteristics (Ta=25℃)
| Item | Symbol |
Absolute Maximum Rating
| Units |
| Power dissipation | Pd |
3 | W |
| DC Forward Current | IF | 700 | mA |
| Peak Forward Current | IFp | 800 | mA |
| Reverse Voltage | VR | 5 | V |
| Operating Temperature | Topr | -20 ~ +85 ℃ | |
| Storage Temperature | Tstg | -40 ~ +100 ℃ | |
| Junction Temperature | Tj | 100°C | |
Tapping specifications (Units: mm)
Tape Dimensions: Loaded Quantity 1000pcs per reel
Application
Precautions for use :
Soldering
SMD LED encapsulation gumwater is flexible, and external force easily damages radiant surface and plastic shell.So when soldering , Please handle with care!
A. Reflow soldering shall be not more than two times and is suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean and unclean surface may influence the emitting color.
B. Manual soldering is only used for reparing. Anti-static iron (25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The soldering time should be not more than 3 seconds.
C. Don’t twist LED in course of manual soldering and testing, which may cause LED failure.
D. Please select the LED devices in the same BIN on the same PCB, otherwise may cause chromatic aberration.
Cleaning
A . Ultrasonic cleaning is not allowed. We recommend isopropyl alcohol or pure alcohol to for cleaning or dipping within 1 minute and reuse after 15 minutes in room temperature. LThe radiant surface shall be clean after cleaning and other wisemayh influence radiant color.
B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride, acid, alkali and salt shall be avoided from LED, which may cause damage to LED.
Encapsulation
A . Encapsulation glue containing sodium ion or sulfide shall be avoided, which may cause fading fluorescence powder (poisoning).
B . When using normal encapsulation glue, trial testing is recommended for 168-hour operation before mass production.
Storage
A. The LED should be stored at 30℃ or less and 60%RH or less before opening the package. The storage shall not be over half a year.
B. After opening the package, the LEDs should be kept at 30-35%RH or less, and should be used within 3 days.
C. When temperature card shows 20% above after package opened, baking treatment shall be conducted before use(for reel package,: baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4 hrs)
D. Acid, alkali and corrosive gas should be avoided in storage environment and intensively shock and high magnetic field also avoided.
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